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■Applications ・Packages that require narrow space filling, such as FC-CSP and FC-SiP modules. ・Suitable for packages that require high heat dissipation ■Features ・Possible to fill narrow spaces without voids ・Molding shrinkage rate, linear expansion coefficient, and elastic modulus can be adjusted depending on the application ・High thermal conductivity available ・Compatible with transfer molding and compression molding
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Encapsulant for mold underfillHandling Company
Kyocera Corporation| Image | Price (excluding tax) |
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Available upon quote |
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