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■Low warpage compatible It is possible to deal with warpage by selecting an appropriate molding shrinkage rate, coefficient of linear expansion, and modulus of elasticity. - High thermal conductivity (3~6W/mK) MUF and compression molding materials are also available. ・Supports fine pitch thin wire and copper wire bonding.
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BGA encapsulantHandling Company
Kyocera Corporation| Image | Price (excluding tax) |
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Available upon quote |
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