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Ceramic package Package for light emitting and light receiving devices-Kyocera Corporation

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There are various types of optical sensors that detect visible and invisible light, from low-end to high-end, and they are used depending on the application. Kyocera proposes ceramic packages tailored to customer applications, from low-end products to high-end products that require high heat dissipation, and has been adopted by our customers. In addition to packaging, we also have suggestions for lids. ■Features ・Hermetic sealing ・High heat dissipation ・Miniaturization - Abundant secondary mounting options ・Hollow structure case study ■Surface-mounted infrared sensor concept You can replace the pin insertion mounting of the metal CAN package with a reflowable surface mount type. In addition, it has been made smaller and thinner by using 3D wiring. Furthermore, we can also propose designs that match the chip size you are using. ■Concept of high-end infrared sensor ・Uses alumina/aluminum nitride with high heat dissipation properties ・In fields where long-term reliability is required, mounting on a PCB (printed circuit board) is done by inserting pins to ensure secondary mounting reliability. ・Can be hermetically sealed ・Uses metal materials with high heat dissipation properties ・Airtight/vacuum sealed (with vacuum pipe included) ■Lid with infrared transmission window We can also provide lids with infrared transparent windows made of silicon, germanium, etc. ■Other photodetector packages ・Image sensor ・For CT scan


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    Package/lid for optical sensor (light receiving element)

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Ceramic package Package for light emitting and light receiving devices Package/lid for optical sensor (light receiving element)'s performance table

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Ceramic package Package for light emitting and light receiving devices-Part Number-Package/lid for optical sensor (light receiving element) Available upon quote

There are 7 models for this product.

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