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Ceramic package Package for light emitting and light receiving devices-Kyocera Corporation

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The lifespan of a laser diode (LD) will be shortened if it is exposed to high temperatures, so it is important to take measures to prevent heat generation from the device. Kyocera provides ceramic packages and substrates with high heat dissipation. Ceramics with high thermal conductivity can efficiently dissipate heat from elements. We offer ceramic packages and submounts to meet customer needs. ■Features ・High degree of freedom in structure ・High heat dissipation ・Miniaturization ・Surface mounting ・Can be hermetically sealed ・Available for various membrane configurations Surface mount ceramic multilayer package ■Low inductance (low resistance) design ・Minimize wire length with stepped structure ・Design with increased number of vias ■Additional functions ・Vent hole ・Eye safety ■Features of laser submount ・Since a film is applied after polishing, flatness can be ensured and optical axis wobbling can be reduced. - Supports AuSn vapor deposition, eliminating the need for an AuSn preform during mounting.


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  • Part Number

    Substrate/package for surface emitting laser (VCSEL)

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Ceramic package Package for light emitting and light receiving devices Substrate/package for surface emitting laser (VCSEL)'s performance table

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Ceramic package Package for light emitting and light receiving devices-Part Number-Substrate/package for surface emitting laser (VCSEL) Available upon quote

There are 7 models for this product.

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