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Laser modules equipped with multiple elements are being considered in order to miniaturize devices. Kyocera is proposing a high heat dissipation package that integrates Cu base and ceramics. ■Features ・Hermetic sealing ・High heat dissipation ・Miniaturization ・Surface mounting ・Joining different materials Concept introduction ■Top illumination type ・High heat dissipation package with Cu base (thermal conductivity: 398W/ (m・K)) ・Miniaturization through modularization with multiple elements ・Available for airtight sealing
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Edge-emitting laser package (multi-chip concept)Handling Company
Kyocera CorporationCategories
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