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Exposure to high heat will shorten the lifespan of laser diodes, so it is essential to take measures to prevent heat generation. Kyocera's ceramic package submount has high heat dissipation properties and can contribute to long device life. Furthermore, it is possible to meet the demand for smaller and thinner products. Features ■High heat dissipation Ceramics with high thermal conductivity can efficiently dissipate heat from elements. ■High degree of freedom in structure Ceramic packages have a high degree of structural freedom, allowing for surface mounting, miniaturization of devices, and mounting of multiple elements in one package. ■Hermetic sealing Laser elements deteriorate when exposed to outside air, so as a countermeasure, they must be hermetically sealed. Ceramic packages can be hermetically sealed. ■Various membrane configurations Kyocera can process thin films with a variety of film configurations and can be customized according to the application. Surface mount ceramic multilayer package ■Package concept example for edge-emitting lasers ・Single chip ・RGB module ■Multiple chip installation concept We also propose concepts that incorporate multiple elements. Laser submount ■Low inductance (low resistance) design We can process steps and grooves for mounting lenses. ■Industrial laser submount (thick Cu product) ・Thick conductor (Cu) with high thermal conductivity and low resistance ・Uses a base material (AlN) with high thermal conductivity ・Uses a polished thin film substrate with high flatness
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Substrate/package for edge-emitting lasersHandling Company
Kyocera CorporationCategories
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