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The lifespan of light emitting diodes (LEDs) will be shortened if they are exposed to high temperatures, so it is important to take measures to prevent heat generation from the elements. Kyocera provides ceramic packages and substrates with high heat dissipation. Ceramics with high thermal conductivity can efficiently dissipate heat from elements. ■Features ・High heat dissipation and high thermal conductivity ・Easy to form cavity ⇒ Easy to resin potting ・Hermetic sealing ・Available for various membrane configurations Concept introduction ■Surface mount multilayer package (alumina/aluminum nitride) ・Round cavity ・Square cavity ・Airtight seal specification ・Step for mounting lid ・Diagonal cavity ・With heat spreader ■Single layer thin film substrate ・High heat dissipation aluminum nitride (thermal conductivity: 170-230W/ (m・K)) can be used ・Membrane configurations can be proposed depending on the application ■Multilayer substrate + thin film ・It is also possible to perform thin film processing on multilayer packages and substrates. - When mounting multiple elements, you can design the circuit including internal layer wiring.
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LED substrate/package for general lightingHandling Company
Kyocera CorporationCategories
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