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Price (excluding tax)
Response Rate
100.0%
Response Time
40.5hours
Image sensors are used in a variety of applications, including digital cameras and smartphones, PCs, automobiles, drones, and FA equipment. Ceramic packages take advantage of features such as high rigidity, high heat dissipation, low dust generation, and high degree of structural freedom, and are used in image sensors for a wide range of applications. ■Characteristics of ceramics ・It has higher thermal conductivity than organic materials and can efficiently dissipate heat from the element. ・The amount of deformation when heat is applied is smaller than that of organic materials, and the effects of heat during mounting can be suppressed. ・Since it does not absorb water, the effect of moisture on the element can be suppressed. ・It is less likely to generate dust than organic materials, and can reduce yield deterioration during assembly due to dust. ■Features of ceramic package ・Three-dimensional structures including electrical wiring can be easily realized using a method of laminating sheets processed one layer at a time. A wire bonding shelf is installed to reduce wire length and improve electrical characteristics. -Thermal expansion coefficient is close to that of elements (Si, etc.), which alleviates element distortion during mounting and ensures device characteristics. ・It has high rigidity, and by making the bottom plate thinner, it is possible to reduce the height of the device.
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Image sensor packageHandling Company
Kyocera CorporationCategories
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Available upon quote |
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Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
40.5hrs
