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■Wafer compatible model (MLD-101P) Previously, this device used a method of connecting the RF cable to the SMA connector and inputting the surface acoustic wave drive signal. However, this method requires the bonding of the SMA connector to the device electrode to be evaluated, which requires time and effort to prepare the evaluation sample, so we developed a new device that uses a drive method that uses a high-frequency probe grounding method. It supports device evaluation on up to 8-inch wafers while maintaining and improving the performance of conventional equipment.
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Attached objective lens magnification
Compatible sample
Data recording format
Device configuration
External dimensions (weight)
Focus (electric control)
Light source/observation axis
Mapping (electric control)
Observation frequency
Observation method
Rack external dimensions (weight)
Utility
Vibration detection method
Part Number
MLD-101PProduct
Vibration measurement device Speed sensor Sagnac interferometer vibration observation deviceHandling Company
Neoark Co., Ltd.Categories
| Image | Price (excluding tax) | Attached objective lens magnification | Compatible sample | Data recording format | Device configuration | External dimensions (weight) | Focus (electric control) | Light source/observation axis | Mapping (electric control) | Observation frequency | Observation method | Rack external dimensions (weight) | Utility | Vibration detection method |
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Available upon quote | ×100 (W.D. 12mm, spot diameter 1μm typ.), ×50 (W.D. 3.4mm, spot diameter 5μm typ.) *×5 (for observation position confirmation) | Wafer (up to 8 inches) | Image: JPEG, Video: AVI, Amplitude/Phase information: CSV | Main body (optical system/stage) laser power supply stage driver frequency conversion unit lock-in amplifier Signal generator (2ch) PC, display observation software | 600 (W) × 600 (D) × 1350 (H) mm (approx. 270kg) | Focus position resolution: 0.2μm, focus range: ±15mm | Semiconductor laser (observation axis: out-of-plane direction *out-of-plane vibration detection) | Mapping position resolution: 0.1µm, maximum mapping (observation) range: 25×25mm | 500MHz~3GHz (Type A) 3GHz~6GHz (Type B) | Laser irradiation position scanning observation using stage control | 600 (W) × 630 (D) × 1,600 (H) mm (approx. 40kg) | AC100V, power consumption 1.7kVA or less | Amplitude and phase detection using Sagnac interferometer |
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