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Automatic retrofit soldering equipment (MINI.DIP equipment) MD series-Morinaga Giken Co., Ltd.

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■Summary Equipped with a pre-heater function that greatly improves quality and productivity. Introducing the industry's first automatic retrofit soldering device equipped with a preheater function. Preheating improves the adhesion of solder to electronic components, leading to further improvements in quality and productivity. Changing various settings, which was difficult in the past, is now easy with the introduction of PLC control. In addition, it boasts outstanding accuracy with accurate temperature management using PID control, and the addition of a component holding tilt function improves solder cutting and increases productivity. It is compatible with all types of solder, so lead solder can also be used as usual. ■Features and benefits Soldering is possible with easy settings even without specialized knowledge. ・Preheater function → activation of flux, stable quality, improvement of work efficiency ・External heater → Improved heater durability, less oxidation inside the solder bath ・Automation → cost reduction, labor saving, productivity increase ・Small and lightweight → Space saving, can be set up anywhere ・Lead-free → Environmental protection, improved corporate image ・Multi-point soldering → Ideal for soldering connectors, parts, and other items ■ Panel-mounted PLC By displaying/changing set values ​​and current values ​​on the panel in two stages, in addition to PLC functions, this single unit also functions as a timer, counter, temperature controller, etc. ■Built-in operation switch Equipment operation and data settings such as timers and counters can be easily changed. The operation switch can also be used as an input. ■Accurate temperature control By adopting a digital proportional control method for solder temperature adjustment, highly accurate temperature control with an error range of ±3°C is achieved. ■ Holder tilt function (optional) By creating a diagonal angle on the board to improve solder cutting, excess solder is pulled back by surface tension, creating a condition where defects such as bridging and icicles are less likely to occur. ■Replaceable masking jig (optional) By replacing the masking jig that serves as a board holder and the jet nozzle, it is possible to handle all types of boards.


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  • Part Number

    MD-2500SP

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Automatic retrofit soldering equipment (MINI.DIP equipment) MD series MD-2500SP's performance table

Image Price (excluding tax) FP-e controller Heater capacity Jet amount Jet motor Operating temperature range Option Power supply Preheater setting time Size Solder capacity Soldering area Temperature detection Weight
Automatic retrofit soldering equipment (MINI.DIP equipment) MD series-Part Number-MD-2500SP Available upon quote Timer/temperature controller/PLC programming 500W×2 sheathed heater Continuously variable (volume) 25W speed control type induction motor Can be set to 200℃~300℃ Jet nozzle, masking jig, presser tilt function AC100V 50/60Hz 1,100W Can be set from 0 to 999 seconds W340m/m×D470m/m×H240m/m Approximately 25kg 210m/m×160m/m CA-K type thermocouple Approx. 27kg (excluding solder)

There are 7 models for this product.

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