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Bending strength 20° (Mpa)
Bulk density ( g/cm3)
Color
Dielectric constant 1MHz
Dielectric strength (kV/mm)
External dimensions
Fracture toughness (Mpa･m1/2)
Hardness (HV) (Gpa)
Linear expansion coefficient RT~200℃ ( ×10^-6/℃)
Linear expansion coefficient RT~400℃
Main component
Plate thickness dimension
Poisson's ratio
Thermal conductivity 20℃ ( W/ ( m･K) )
Thermal emissivity (100%)
Thermal shock resistance (℃)
Volume resistivity 20℃ (Ω･cm)
Water absorption rate (%)
Young's modulus (Gpa)
Part Number
Aluminum nitride (ALN) (without auxiliary agent)Handling Company
Shimizu Shokai Co., Ltd.Categories
| Image | Price (excluding tax) | Bending strength 20° (Mpa) () | Bulk density ( g/cm3) () | Color () | Dielectric constant 1MHz () | Dielectric strength (kV/mm) () | External dimensions () | Fracture toughness (Mpa･m1/2) () | Hardness (HV) (Gpa) () | Linear expansion coefficient RT~200℃ ( ×10^-6/℃) () | Linear expansion coefficient RT~400℃ () | Main component () | Plate thickness dimension () | Poisson's ratio () | Thermal conductivity 20℃ ( W/ ( m･K) ) () | Thermal emissivity (100%) () | Thermal shock resistance (℃) () | Volume resistivity 20℃ (Ω･cm) () | Water absorption rate (%) () | Young's modulus (Gpa) () |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Available upon quote | 300 | 3.2 | Beige | 8.8 | 15 | □200, □300, φ200, φ300, etc. | 3 | 13 | 2.4 | 4.5 | A.L.N. | 0.25~30mm | 0.29 | 90 | 0.93 | 400 | >10^13 | 0 | 430 |
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Reviews shown here are reviews of companies.
