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Bending strength 20° (Mpa)
Bulk density ( g/cm3)
Color
Dielectric constant 1MHz
Dielectric constant 3GHz
Dielectric strength (kV/mm)
Fracture toughness (Mpa･m1/2)
Hardness (HV) (Gpa)
Linear expansion coefficient RT~200℃ ( ×10^-6/℃)
Linear expansion coefficient RT~800℃
Main component
Poisson's ratio
Specific heat RT ( J/ ( kg･K) )
Thermal conductivity 20℃ ( W/ ( m･K) )
Thermal shock resistance (℃)
Volume resistivity 20℃ (Ω･cm)
Water absorption rate (%)
Young's modulus (Gpa)
Part Number
Silicon nitride (Si3N4)Handling Company
Shimizu Shokai Co., Ltd.Categories
| Image | Price (excluding tax) | Bending strength 20° (Mpa) () | Bulk density ( g/cm3) () | Color () | Dielectric constant 1MHz () | Dielectric constant 3GHz () | Dielectric strength (kV/mm) () | Fracture toughness (Mpa･m1/2) () | Hardness (HV) (Gpa) () | Linear expansion coefficient RT~200℃ ( ×10^-6/℃) () | Linear expansion coefficient RT~800℃ () | Main component () | Poisson's ratio () | Specific heat RT ( J/ ( kg･K) ) () | Thermal conductivity 20℃ ( W/ ( m･K) ) () | Thermal shock resistance (℃) () | Volume resistivity 20℃ (Ω･cm) () | Water absorption rate (%) () | Young's modulus (Gpa) () |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Available upon quote | 800 | 3.2 | Gray black | 8 | 8 | 8 | 6 | 15 | 2 | 3.2 | Si3N4 | 0.29 | 630 | Twenty five | 700 | >10^14 | 0 | 290 |
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Reviews shown here are reviews of companies.
