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  5. GU37 mold frame series
Test socket burn-in test for IC devices-Japan Connect Industry Co., Ltd.

GU37 mold frame series | Test socket burn-in test for IC devices
Japan Connect Industry Co., Ltd.

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Model Description

Clamshell type, frame size 37x39mm ■Features ・High reliability ・Low cost ・Quick delivery ・Operating temperature range: -40~+150℃ (typ.) ■Lid type (you can choose the one that suits your purpose) ・Spring type ・Seesaw type with window ・Seesaw style

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  • Part Number

    GU37 mold frame series

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Test socket burn-in test for IC devices GU37 mold frame series's performance table

Image Price (excluding tax) Compatible device
Test socket burn-in test for IC devices-Part Number-GU37 mold frame series Available upon quote 0.30mm pitch or larger

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Japan Connect Industry Co., Ltd.

  • Japan

Category of this product

BGA Scokets

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