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  5. GQ29-BGA mold frame series
Test socket burn-in test for IC devices-Japan Connect Industry Co., Ltd.

GQ29-BGA mold frame series | Test socket burn-in test for IC devices
Japan Connect Industry Co., Ltd.

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Model Description

Clamshell type, frame size 29x30.6mm, BGA compatible ■Features ・High reliability ・Low cost ・Quick delivery ・Operating temperature range: -40~+150℃ This is a made-to-order product.

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  • Part Number

    GQ29-BGA mold frame series

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Test socket burn-in test for IC devices GQ29-BGA mold frame series's performance table

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Test socket burn-in test for IC devices-Part Number-GQ29-BGA mold frame series Available upon quote BGA

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About Company Handling This Product

Japan Connect Industry Co., Ltd.

  • Japan

Category of this product

BGA Scokets

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