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  4. Test socket burn-in test for IC devices
  5. GQ29-BGA mold frame series
Test socket burn-in test for IC devices-Japan Connect Industry Co., Ltd.

GQ29-BGA mold frame series | Test socket burn-in test for IC devices
Japan Connect Industry Co., Ltd.

Price (excluding tax)

Estimate Required

Japan Connect Industry Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

62.6hours

Company Review

5.0

Model Description

Clamshell type, frame size 29x30.6mm, BGA compatible ■Features ・High reliability ・Low cost ・Quick delivery ・Operating temperature range: -40~+150℃ This is a made-to-order product.

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  • Part Number

    GQ29-BGA mold frame series

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Test socket burn-in test for IC devices GQ29-BGA mold frame series's performance table

Image Price (excluding tax) Compatible device
Test socket burn-in test for IC devices-Part Number-GQ29-BGA mold frame series Available upon quote BGA

There are 10 models for this product.

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About Company Handling This Product

Japan Connect Industry Co., Ltd.

Response Rate

100.0%

Response Time

62.6hrs

Company Review

5.0
  • Japan

Category of this product

Test Sockets

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