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  5. GU15 frame series
Test socket burn-in test for IC devices-Japan Connect Industry Co., Ltd.

GU15 frame series | Test socket burn-in test for IC devices
Japan Connect Industry Co., Ltd.

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Model Description

Clamshell type, leaf spring structure, frame size 16x33.5mm ■Features ・High reliability ・Low cost ・Quick delivery ・Operating temperature range: -40~+150℃ (typ.)

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  • Part Number

    GU15 frame series

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Test socket burn-in test for IC devices GU15 frame series's performance table

Image Price (excluding tax) Compatible device
Test socket burn-in test for IC devices-Part Number-GU15 frame series Available upon quote SOP, SON, SOJ, SIP, LGA etc.

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About Company Handling This Product

Japan Connect Industry Co., Ltd.

  • Japan

Category of this product

BGA Scokets

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