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  5. GU22 mold frame series
Test socket for IC devices System level test-Japan Connect Industry Co., Ltd.

GU22 mold frame series | Test socket for IC devices System level test
Japan Connect Industry Co., Ltd.

Price (excluding tax)

Estimate Required

Japan Connect Industry Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

62.6hours

Company Review

5.0

Model Description

Clamshell type, frame size 22x22mm ■Features ・The contact part uses a highly reliable M pin probe. - Compatible with high frequencies. - Compatible with thermal environments. ・Quick delivery. ・Low cost.

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Compatible device

Operating temperature range

Pitch

Contact resistance

Capacitance

Characteristic impedance

Frequency

Probe pin type

Self inductance

Durability

Insertion force/per pin

Mutual capacitance

Mutual inductance

Rated current/per pin

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  • Part Number

    GU22 mold frame series

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Test socket for IC devices System level test GU22 mold frame series's performance table

Image Price (excluding tax) Compatible device
Test socket for IC devices System level test-Part Number-GU22 mold frame series Available upon quote BGA (WLCSP), QFN, LGA

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About Company Handling This Product

Japan Connect Industry Co., Ltd.

Response Rate

100.0%

Response Time

62.6hrs

Company Review

5.0
  • Japan

Category of this product

BGA Scokets

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