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■Summary A wafer with a thin film of silicon attached to a stable glass substrate. It is possible to form a 1μm thin silicon film on a glass substrate. Used for applications such as optical devices and packaging.
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Applicable wafer size
Finishing
Material
Thickness
Polyimide
Part Number
Si-Pyrex bond waferProduct
High-performance boardHandling Company
Micro Semiconductor Research Co., Ltd.Categories
| Image | Price (excluding tax) | Applicable wafer size () | Finishing () | Material () | Thickness () |
|---|---|---|---|---|---|
| Available upon quote | 100mm | Active layer: polished Support substrate: polished | Active layer: Si Support substrate: Pyrex glass | Active layer: 1μm Support substrate: 525μm |
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