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■Summary This is a piezo bond wafer in which a piezoelectric element is bonded to a silicon wafer. Used for applications such as pressure sensors and actuators.
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Applicable wafer size
Finishing
Material
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Polyimide
Part Number
Piezo bond waferProduct
High-performance boardHandling Company
Micro Semiconductor Research Co., Ltd.Categories
| Image | Price (excluding tax) | Applicable wafer size | Finishing | Material | Polyimide | Thickness |
|---|---|---|---|---|---|---|
| Available upon quote | 100mm | Active layer: polished Support substrate: etching | Active layer: PZT Support substrate: Si | Adhesive curtain: 1μm | Active layer: ~0.5μm Support substrate: 525μm |
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