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Our tabletop wafer plating equipment is compatible with face-up type and vertical dip type, depending on the application and needs. It is used in research laboratories of electronic device-related companies and universities. ■ Features - Experiments can be performed with a small amount of plating solution - By replacing the jig, it is possible to handle everything from coupon size to multiple wafer sizes. - Can be installed on a laboratory bench or in an existing fume hood
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Tabletop wafer plating equipmentHandling Company
Toset Co., Ltd.Categories
Usage Scenarios
Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use| Image | Price (excluding tax) | Method | Panel size | Plating material | Wafer size |
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Available upon quote | Face-up type/vertical dip type | ~300mm / more | Cu, Au, Ni, Sn, SnAg, magnetic film, etc. | Max.300mm |
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