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  3. Semiconductor Manufacturing Equipment Component & Part Machining
  4. Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT
  5. TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer)
Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-Toset Co., Ltd.

TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer) | Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT
Toset Co., Ltd.

💻 Electronics & Electrical Use 🚀 Aerospace Industry Use 🚗 Automotive & Transport Use

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Model Description

Semi-automatic vertical dip plating equipment (for wafers)

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Method

Panel size

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Wafer size

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  • Part Number

    TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer)

  • Usage Scenarios

    Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use

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Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer)'s performance table

Image Price (excluding tax) Method Panel size Plating material Wafer size
Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-Part Number-TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer) Available upon quote Vertical dip type N/A Cu, Ni, Au, etc. Max. 300mm

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Toset Co., Ltd.

  • Japan

Category of this product

Semiconductor Manufacturing Equipment Component & Part Machining

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