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Coverlay material
Material
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Minimum copper foil thickness
Minimum hole diameter (drill)
Minimum hole diameter (laser)
Mold outline intersection
Reinforcement plate type
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Custom madeProduct
FPC mass production boardHandling Company
Cygnus Co., Ltd.Categories
Image | Price (excluding tax) | Coverlay material | Material | Maximum production size | Minimum L/S | Minimum copper foil thickness | Minimum hole diameter (drill) | Minimum hole diameter (laser) | Mold outline intersection | Reinforcement plate type | Shield material | Surface treatment | Terminal outline intersection |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Available upon quote | Polyimide/Solder resist/PET | Polyimide/PET/LCP | Panel:500X610mm Roll to roll: 250mm width | 35/35μm | 9μm | 100μm | 50μm | ±25μm | Polyimide/FR-4/PET/Metal | Various handling | Gold flash/flux/tin plating/ Gold plating over Ni-Pd (for bonding) / Other various gold plating (hard/soft gold) | ±50μm |
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Reviews shown here are reviews of companies.