All Categories
History
Price (excluding tax)
You can search for other models from each index. The displayed value is the value of the currently selected part number.
Bow
Crystal orientation
Dopant type
Doping
Low efficiency
Roughness
Silicon growth method
Thermal oxidation Field oxide film thickness
Thickness deviation (TTV)
Wafer thickness
Wafer thickness tolerance range
Warp
Part Number
DSP Wafer Wafer diameter 100mmProduct
DSP WafersHandling Company
Icemos Technology Japan Co., Ltd.Categories
| Image | Price (excluding tax) | Bow | Crystal orientation | Dopant type | Doping | Low efficiency | Roughness | Silicon growth method | Thermal oxidation Field oxide film thickness | Thickness deviation (TTV) | Wafer thickness | Wafer thickness tolerance range | Warp |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Available upon quote | ≤40μm | 100, 111 or 110 | N or P | N type: Phos, Red Phos, Sb＆As P type: Boron | ≤0.001 - ≥10,000 Ω-cm | ≤2Å | CZ, MCZ or FZ | 0.2-4.0 μm | ≤1μm | 200-1,100μm | ±2μm | ≤40μm |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
