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  1. Metoree
  2. Liquid epoxy encapsulant for semiconductors
  3. Pre-installed underfill agent (NCP: Non-Conductive Paste)
Liquid epoxy encapsulant for semiconductors-Nagase ChemteX Co., Ltd.

Pre-installed underfill agent (NCP: Non-Conductive Paste) | Liquid epoxy encapsulant for semiconductors
Nagase ChemteX Co., Ltd.

Price (excluding tax)

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Nagase ChemteX Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

92.9hours

Model Description

■Features ・Super fast curing, 5 seconds pressure welding possible ・Excellent workability ・Available for a wide variety of products with just a dispenser ・High heat resistance ・High moisture resistance ・High purity

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  • Part Number

    Pre-installed underfill agent (NCP: Non-Conductive Paste)

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Liquid epoxy encapsulant for semiconductors Pre-installed underfill agent (NCP: Non-Conductive Paste)'s performance table

Image Price (excluding tax)
Liquid epoxy encapsulant for semiconductors-Part Number-Pre-installed underfill agent (NCP: Non-Conductive Paste) Available upon quote

There are 3 models for this product.

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About Company Handling This Product

Nagase ChemteX Co., Ltd.

Response Rate

100.0%

Response Time

92.9hrs

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