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Liquid epoxy encapsulant for semiconductors-Nagase ChemteX Co., Ltd.

Price (excluding tax)

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Nagase ChemteX Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

92.9hours


Model Description

■Features ・High fluidity suitable for large area/thin film molding ・Liquid at room temperature/dispensable, dust-free suitable for clean room environments ・Low temperature molding possible (125℃) ・Low stress design achieves low warpage in large area molding ・High reliability ・High purity ・Low alpha rays


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  • Part Number

    Liquid molding compound (LMC)

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Liquid epoxy encapsulant for semiconductors Liquid molding compound (LMC)'s performance table

Image Price (excluding tax)
Liquid epoxy encapsulant for semiconductors-Part Number-Liquid molding compound (LMC) Available upon quote

There are 3 models for this product.

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About Company Handling This Product

Response Rate

100.0%


Response Time

92.9hrs

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