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Manual vertical dip plating equipment (without housing type) The vertical dip type is a method used in a wide range of applications. Recommended for research and development and contract processing manufacturers that handle various plating film types and substrate sizes. ■Features - Capable of handling multiple wafer sizes by replacing jigs - Paddle stirring mechanism optimized for wafer plating - Can also be used for double-sided plating - Overflow tank and filtration circulation to minimize bath volume - We will design the best jig for your board specifications. - The number of plating tanks can be adjusted according to your request. - Can also be equipped with pre-deaeration treatment and drying treatment after washing with water.
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Method
Panel size
Plating material
Wafer size
Part Number
TEMM-VT：Manual Vertical Dip Plating ToolHandling Company
Toset Co., Ltd.Categories
Usage Scenarios
Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use| Image | Price (excluding tax) | Method | Panel size | Plating material | Wafer size |
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Available upon quote | Vertical dip type | ~300mm / more | Cu, Ni, Au, etc. | Max. 300mm |
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