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Semi-automatic face-up plating equipment (without housing type) Due to its high in-plane film thickness uniformity and efficient workability, it is suitable not only for research and development but also for small-volume production of products. ■Features - Excellent film thickness uniformity achieved by paddle stirring and high positional accuracy (±2% when using optional auxiliary electrode) - No need to attach or detach the wafer to the jig; just place it on the wafer stage to complete the setup. - Automate the process from supplying liquid to the tank → plating → draining → primary washing under the tank
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TEAM-FU：Semi-Automated Face-Up Plating ToolHandling Company
Toset Co., Ltd.Categories
Usage Scenarios
Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use| Image | Price (excluding tax) | Method | Panel size | Plating material | Wafer size |
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Available upon quote | Face up type | N/A | Magnetic film, Cu, Ni, Au, etc. | Max. 300mm |
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