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Japan Engis Co., Ltd.'s Abrasive Compounds

Japan Engis Co., Ltd.

2 products found

CMP slurry-Japan Engis Co., Ltd.

Japan Engis Co., Ltd.

CMP slurry

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CMP (abbreviation for Chemical Mechanical Polishing) slurry is used to chemically etch the workpiece surface and mechanically remove and polish it....


Polishing compound-Japan Engis Co., Ltd.

Japan Engis Co., Ltd.

Polishing compound

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A polishing compound made by colloidally concentrating alumina, silica, and cerium, which are the main abrasive grains for polishing. specificatio...



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