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Nippon Gijutsu Sangyo Co., Ltd.'s Substrate Cutting Machines

Nippon Gijutsu Sangyo Co., Ltd.

2 products found

Dicing machine for square substrates for 2 inch spindle 7302-Nippon Gijutsu Sangyo Co., Ltd.

Nippon Gijutsu Sangyo Co., Ltd.

Dicing machine for square substrates for 2 inch spindle 7302

180+ people viewing

Last viewed: 1 day ago

■Dicing saw Cutting equipment used in the semiconductor chip production process. Machining is done by rotating a rotary blade embedded with industr...


Dicing machine for square substrates for 4 inch spindle 7304-Nippon Gijutsu Sangyo Co., Ltd.

Nippon Gijutsu Sangyo Co., Ltd.

Dicing machine for square substrates for 4 inch spindle 7304

140+ people viewing

Last viewed: 12 hours ago

■Dicing saw Cutting equipment used in the semiconductor chip production process. Machining is done by rotating a rotary blade embedded with industr...



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