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Japan Engis Co., Ltd.'s Lapping Machinery

Japan Engis Co., Ltd.

9 products found

Japan Engis Co., Ltd.

Horizontal grinder EHG series

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Last viewed: 6 hours ago

The horizontal grinder EHG series is equipped with a soft touch panel, enabling high-precision grinding with easy operation. Closed-loop control is...

Japan Engis Co., Ltd.

Tabletop/stationary wrapping equipment

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Last viewed: 7 hours ago

Tabletop and stationary lapping machines are designed to be the perfect size for creating highly flexible polishing processes from lab scale to pro...

Japan Engis Co., Ltd.

Double-sided wrapping device

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Last viewed: 7 hours ago

The EJD series is a double-sided polishing machine that is widely compatible with general abrasive grains, diamond abrasive grains, and fixed grind...

Japan Engis Co., Ltd.

High speed/high pressure wrapping equipment EJW-380HSP

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Last viewed: 7 hours ago

EJW-380HSP series is a polishing device compatible with high-speed & high-pressure polishing machines. This machine is designed to polish substrat...

Japan Engis Co., Ltd.

Large wrapping device

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Last viewed: 7 hours ago

We have a complete lineup of high-precision large lapping machines of various sizes to meet the high-precision lapping processing required by the m...

Japan Engis Co., Ltd.

Vertical grinder HVG series

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Last viewed: 6 hours ago

The HVG series vertical grinder has a lineup that matches the wafer size. It has a compact yet highly rigid body structure that is suitable for eve...

Japan Engis Co., Ltd.

2-axis vertical grinder HVG-300DSO

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Last viewed: 7 hours ago

The 2-axis vertical grinder HVG-300DSO uses a sliding work spindle designed to improve the quality of grinding. With one grinding device, grinding ...

Japan Engis Co., Ltd.

2-axis vertical grinder HVG-300DSR

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Last viewed: 7 hours ago

The 2-axis vertical grinder HVG-300DSR uses a rotary work spindle designed to improve grinding efficiency. Highly efficient grinding is achieved be...

Japan Engis Co., Ltd.

Wrapping plate

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Last viewed: 6 hours ago

Efficient lapping requires proper lapping plate selection. Select the plate according to the processing purpose (processing amount, surface roughne...


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