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This section provides an overview for gold solders as well as their applications and principles. Also, please take a look at the list of 16 gold solder manufacturers and their company rankings. Here are the top-ranked gold solder companies as of December, 2024: 1.Mitsubishi Materials Corporation, 2.Gesswein Co, Inc., 3.Jaytee Alloys and Components Pvt. Ltd..
Table of Contents
Gold-tin (AuSn) alloy paste is a form of gold (Au) and tin (Sn) alloy primarily used as solder material, provided in paste form.
Essentially, it comprises a mixture of gold-tin alloy powder and a binding material called flux. Gold-tin alloys have a higher melting point (217°C and above) compared to common lead-free solders, and they excel in heat conductivity and post-bonding reliability. They are used for joining and sealing precision components such as high-frequency devices, optical devices, and for applications requiring heat resistance during subsequent low-temperature reflow, as well as for soldering applications needing tensile strength and corrosion resistance.
Gold-tin (AuSn) alloy paste is primarily used for bonding and sealing precision components such as:
Die bonding for high-brightness LEDs, Peltier elements, power semiconductors
Sealing materials for crystal devices, SAW devices
The former is used in automotive, lighting, and thermoelectric module applications, while the latter is used in mobile communications, base stations, MEMS sensors, among others. It is a solder material used for bonding high-frequency devices and optical communication devices.
Moreover, gold-tin (AuSn) alloy paste's paste form allows for high adaptability to various bonding methods such as screen printing, dispenser coating, and pin transfer, making it suitable for various joint shapes.
Typically, gold-tin (AuSn) alloys with around 20% tin content are commonly used. The main compositions of gold-tin (AuSn) alloys along with their melting points and densities are as follows:
AuSn18: 278-360°C, Density 14.89
AuSn20: 278-300°C, Density 14.52
AuSn21: 278°C, Density 14.35
AuSn21.5: 278°C, Density 14.26
AuSn22: 278°C, Density 14.17
AuSn90: 217°C, Density 7.78
Gold-tin alloys have a higher melting point than common lead-free solders, excellent heat conductivity, post-bonding reliability, and good wetting properties. They offer superior thermal conductivity compared to thermosetting Ag epoxy resins, leading to high joint strength. They are particularly suitable for applications requiring heat resistance during low-temperature reflow, as well as for applications requiring tensile strength and corrosion resistance.
Besides paste materials, gold-tin (AuSn) solders are also available in foil form (preform solders). Using foil materials requires remaking molds when there are changes in bonding surface shape or size, incurring additional costs. Paste materials do not require molds, offering flexibility in supply for various sizes and shapes. Paste materials are also compatible with various supply methods like printing, dispensing, and pin transfer, making them versatile solder materials.
Gold-tin (AuSn) alloy paste comes in various compositions, mainly with around 20% tin content like AuSn18 or AuSn22. The powder size of the alloy in the paste varies depending on the intended application, with typical types including:
Printing: 16-53um, 16-32um, <32um, 5-16um
Dispensing: 5-16um, 16-32um
Pin transfer: <11um
Thin-film formation: <11um
Traditional gold-tin (AuSn) alloy pastes using nitrogen gas during reflow required a cleaning process due to residual flux after reflow. Recent developments using glycol reflow processes revealed that high-temperature-resistant rosin and activators, previously needed for oxide removal in traditional pastes, are unnecessary. This dramatic reduction in post-reflow flux residue has led to non-cleaning gold-tin (AuSn) alloy pastes, eliminating the need for cleaning processes.
*Including some distributors, etc.
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Nanoshel is an Indian manufacturer of engineered nanomaterials and nanocompounds that was established in 2005 as a subsidiary of Intelligent Materials Pvt Limited. Based in Sundran, Punjab, the company produces various quantum dots, carbon nanotubes, and nanopowders from different materials including metal and graphene. It also offers a range of organics as well as inorganics, such as nano-enhanced fertilizers, wafers, and nanoparticle dispersions. Nanoshel products are commonly used in the production of consumer electronics, as well as in the agriculture, biomedical, and energy industries.
Indium Corporation, established in 1996, is an ISO 9001:2015 certified manufacturer and supplier of advanced electronics assembly materials solutions. The company provides solder and thermal management products for over 3,000,000 electric vehicles. Their products are used in essential markets such as medical equipment, fire suppression, transportation, automotive, defense, and emergency communication devices. They have facilities across the Americas, Asia/Pacific, China, and Europe, with multiple licenses and certifications in each. Their wide range of products includes solder paste, thermal interface materials, fluxes, die-attach materials, and more.
The Company operates diverse businesses, ranging from nonferrous metals and other fundamental materials to cemented cardide tools/metalworking solutions, the manufacturing of semiconductor-related and electronic components/materials, resource recycling, and renewable energy power generation. In each business, the Company holds the No.1 position in production volume, sales volume, etc.
Gesswein Co, Inc., established in 1914 and headquartered in Bridgeport, Connecticut, is a distributor of jewelers' tools and supplies. The company offers a wide range of products, including additive manufacturing tools, abrasives, bench tools, burs & drills, casting tools, cleaning tools, dust collection tools, engraving tools, power tools, and more. These products are utilized by professionals in the jewelry and metalworking industries for precision work. Gesswein Co, Inc. also provides various services, such as operations review, product sampling, account maintenance, quality control, and price matching.
Ranking as of December 2024
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Mitsubishi Materials Corporation |
33.3%
|
| 2 | Gesswein Co, Inc. |
25.0%
|
| 3 | Jaytee Alloys and Components Pvt. Ltd. |
8.3%
|
| 4 | Dynamic Labs |
8.3%
|
| 5 | Metal Clay Ltd |
8.3%
|
| 6 | Shenzhen Fitech Co., Ltd. |
8.3%
|
| 7 | Indium Corporation |
8.3%
|
Derivation Method
The ranking is calculated based on the click share within the gold solder page as of December 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
