Heating process -specific elemental omission reduction pressurized RTA device
Japan Create Co., Ltd.
About This Product
■ Characteristics
・ Reduces the elemental omission peculiar to the heating process
・ Pressure process from decompression process
Can be supported up to (0.9MPAG)
・ High -speed heat oxidation, crystallination, analling processing, etc. of the substrate surface are possible
・ Realizes excellent substrate temperature distribution and gas flow method
・ It can also be used for tray transportation
■ Use
·semiconductor
・ MEMS
・ Electronic components
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Product
Heating process -specific elemental omission reduction pressurized RTA device
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Handling Company
Japan Create Co., Ltd.
1 Models of Heating process -specific elemental omission reduction pressurized RTA device
| Product Image | Part Number | Price (excluding tax) | Board heating temperature | Board size | Control operation | Data logging | Heating source | Reaction gas | Temperature rising rate | Transportation of the board | Vacuum exhaust |
|---|---|---|---|---|---|---|---|---|---|---|---|
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Pressure RTA device |
Available upon quote | Up to 1,000 ° C (substrate surface) | Maximum φ12 inch |
Control: PLC Operation: Touch panel or PC |
External memory or PC | Halogen lamp | O2, N2, H2O (optional) | Up to 150 ° C/sec | Air transport robot, cooling stage | DP |
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About Company Handling This Product
- Japan
- Since 1963
- 40 employees