HiSOL,Inc.

Highly accurate control over a wide pressure control range from vacuum: 100Pa to pressurization: 1.0MPaG, as well as temperatur...

• Test Equipment

• Environmental Testers

Our main product, precision spin coaters, are widely used around the world, and we have a track record of delivering more than ...

• Machining / Machine Tools

• Spin Coaters

The AccuThermo series high-speed heat treatment equipment is an infrared lamp annealing equipment (RTP/RTA system) that heats w...

• Machining / Machine Tools

• Annealing Furnaces

■Summary Model 4KE is a semi-automatic multi-wire bonder that can be used for both ball bonding and wedge bonding. The Y-axis ...

• Semiconductor Manufacturing

• Wire Bonders

■Summary ・Ideal for ultra-high precision mounting applications such as laser-related and opto device mounting. ・High reproduc...

• Semiconductor Manufacturing

• Flip Chip Bonders

■Summary The ultrasonic wedge wire bonder E series is a tabletop manual wedge wire bonder with a vertically driven X-Y-Z 3-axis...

• Semiconductor Manufacturing

• Wire Bonders

■Domestic sales record: 50 units or more Best-selling RTA system ideal for research and development The AccuThermo series high-...

• Machining / Machine Tools

• Annealing Furnaces

The AccuThermo series high-speed heat treatment equipment is an infrared lamp annealing equipment (RTP/RTA system) that heats w...

• Machining / Machine Tools

• Annealing Furnaces

Advances in new mounting technology require optimization of ball/stitch bonds in the wire bonding process. Among these, the cap...

• Hoses / Tubes

• Capillaries

■Summary Model 7372E is a tabletop multi-die bonder equipped with two functions: a eutectic die bonder that mounts chips using ...

• Semiconductor Manufacturing

• Flip Chip Bonders

This device applies centrifugal force in the X-Y-Z directions to devices mounted on aircraft or used in flying objects to perfo...

• Test Equipment

• Environmental Testers

We offer custom double-sided semi-automatic probe systems that allow access to both the front and back sides of the wafer. It c...

• Testing Equipment

• Probers

■Automatic polarization analyzer World's smallest ellipsometer An ellipsometer irradiates a sample with light and measures the ...

• Meters & Instruments

• Ellipsometers

■Summary Model 4546E is a semi-automatic multi-wedge wire bonder. The Y-axis and Z-axis are motor-controlled, allowing you to ...

• Semiconductor Manufacturing

• Wire Bonders

UV PITARI is a tabletop UV curing furnace that is inexpensive, compact, and highly safe. Three types are available: LED type, l...

• Purification Equipment

• Ultraviolet (UV) Dryers

This is a tabletop batch oven that can be heated in a vacuum environment or inert gas atmosphere (N2, Ar etc.). Temperature con...

• Heat Sources

• Vacuum Ovens

■Stand-alone/long-time process 8-inch compatible RTA system The AccuThermo series high-speed heat treatment equipment is an inf...

• Machining / Machine Tools

• Annealing Furnaces

■ If you are particular about semiconductor quality, you must also be particular about cleaning. Achieves a full process from c...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

Logitech (UK), which has a history of over 50 years in the polishing industry, provides the highest level polishing equipment a...

• Semiconductor Manufacturing

• Chemical Mechanical Polishing (CMP) Machines

■Summary Model 7200CR is a tabletop manual die bonder. Equipped with a new X-Y-Z 3-axis manipulator (patented) as standard for ...

• Semiconductor Manufacturing

• Flip Chip Bonders

Logitech (UK), which has a history of over 50 years in the polishing industry, provides the highest level polishing equipment a...

• Semiconductor Manufacturing

• Chemical Mechanical Polishing (CMP) Machines

■Summary Model 7327C manufactured by West Bond is a tabletop manual eutectic die bonder that places a eutectic material (AuSn, ...

• Semiconductor Manufacturing

• Flip Chip Bonders

A desktop wire bonder and die bonder ideal for failure analysis applications. Since it is operated using an X-Y-Z 3-axis manipu...

• Semiconductor Manufacturing

• Wire Bonders

At Hisol Co., Ltd., we design and manufacture laser systems for thin film processing based on customer specifications. By combi...

• Machining / Machine Tools

• Microfabrication Machines

The DL1 automatic lapping machine can process samples up to 200mm/8″φ with high shape accuracy.The polishing function of the dr...

• Machining / Machine Tools

• Lapping Machinery

Nisene, an American company, is an industry pioneer that developed the world's first automatic package opening device that uses...

• FA Equipment

• Bag Opening Machinery

In recent years, the number of resins that do not dissolve even in strong acids has increased, and new techniques are required ...

• FA Equipment

• Bag Opening Machinery

Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing pr...

• Semiconductor Manufacturing

• Flip Chip Bonders

Loranger is one of the world's leading socket manufacturers that has been producing burn-in test IC sockets for over 30 years. ...

• Boards & Circuit Boards

• BGA Scokets

PELCO® FlipScribe® is an unprecedented scriber provided by Ted Pella, USA. It is possible to align the target with high precisi...