Overview
Products Handled By HiSOL,Inc.
Search by Category
Semiconductor inspection equipment
Cleaning Systems
Probe Cards
High Frequency Heating Equipment
Vacuum Vapor Deposition Devices
Probers
Counters
Sputtering Equipment
Semiconductor Inspection Equipment
Coating Process Equipment
Acoustic Microscopes
Coaters
Semiconductor Manufacturing Equipment Component & Part Machining
BGA Scokets
Ellipsometers
Capillaries
Flip Chip Bonders
Plasma-Enhanced CVD
Plasma Cleaners
Plasma Cleaning Systems
Bonding Wire
Lapping Machinery
Wire Bonders
Heating Coils
Deposition Equipment
Environmental Testers
Vacuum Dryers
Grinders
Automatic Pressure Washers
Automatic Titrators
Automated Assembly Systems
Ultracentrifuges
Ultrasonic Flaw Detectors
Non-Destructive Testing (NDT) Systems
High Frequency Induction Heating Devices
Ultraviolet (UV) Dryers
Spin Coaters
Resist Coaters
Microfabrication Machines
Pressure Testers
Logic Probes
Coating Equipment
Annealing Furnaces
Chemical Vapor Deposition (CVD) Systems
Chemical Mechanical Polishing (CMP) Machines
Coating Machines
Bag Opening Machinery
Metal Halide Lamps
FPD Manufacturing Equipment
Semiconductor Cleaning Equipment
Dip Coaters
Scanning Acoustic Microscopes
Vacuum Ovens
HiSOL,Inc.
Tabletop manual cleavage device LatticeAx Manual precision scriber PELCO® FlipScribe®
150+ people viewing
Last viewed: 19 hours ago
PELCO® FlipScribe® is an unprecedented scriber provided by Ted Pella, USA. It is possible to align the target with high precisi...
HiSOL,Inc.
Failure analysis device Nanoprobe
150+ people viewing
Last viewed: 1 day ago
Nanoprobing is essential for failure analysis of semiconductors, which are becoming increasingly finer each year, so probes for...
HiSOL,Inc.
Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)
150+ people viewing
Last viewed: 4 hours ago
Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing pr...
HiSOL,Inc.
Failure analysis device JetEtch Pro Package opening device
140+ people viewing
Nisene, an American company, is an industry pioneer that developed the world's first automatic package opening device that uses...
HiSOL,Inc.
Failure analysis device Laser package opening device Laser Decap PRO2
130+ people viewing
Last viewed: 7 hours ago
In recent years, the number of resins that do not dissolve even in strong acids has increased, and new techniques are required ...
HiSOL,Inc.
Tabletop manual cleavage device LatticeAx Simple scriber PELCO® FlexScribe™
110+ people viewing
PELCO® FlexScribe™ is the perfect tool for cutting samples such as wafers into small pieces by scribing onto the sample surface...
HiSOL,Inc.
WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)
110+ people viewing
Last viewed: 12 hours ago
Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing pr...
HiSOL,Inc.
Microscope loader device V1000
90+ people viewing
Last viewed: 20 hours ago
The V1000 microscope loader can move wafers from the cassette to the microscope inspection stage using software-generated recip...
HiSOL,Inc.
Multibond Tester Sigma
70+ people viewing
Last viewed: 1 day ago
Sigma is a multifunctional bond tester developed by xyztec, a Dutch company specializing in bond testers. Our in-house develope...
HiSOL,Inc.
Plasma stripper descum equipment CV200RFS
50+ people viewing
Last viewed: 22 hours ago
This is a system that performs stripping and descum using plasma in a low-pressure environment. Compared to the conventional we...
HiSOL,Inc.
Tabletop manual cleavage device PELCO® LatticeAx®
40+ people viewing
Last viewed: 1 day ago
Ted Pella (USA) is a cleavage equipment manufacturer that achieves the world's highest level of high-precision cleavage using m...
HiSOL,Inc.
Wire pull tester model 70PTE
30+ people viewing
Last viewed: 1 day ago
Model 70PTE has a vertically driven X-Y-Z 3-axis manipulator built into the main body, making it possible to perform wire pull ...
HiSOL,Inc.
High precision lead former model F-1B/1
30+ people viewing
Last viewed: 22 hours ago
■Summary Fancourt's lead former is a machine with overwhelming precision and excellent operability backed by over 45 years of e...
HiSOL,Inc.
High precision lead former model F-1B/3A
30+ people viewing
Last viewed: 1 day ago
■Summary Fancourt's lead former is a machine with overwhelming precision and excellent operability backed by over 45 years of e...
HiSOL,Inc.
Failure analysis equipment Multifunctional handling and machining system Model FC
30+ people viewing
Precise processing such as collecting fine objects such as FIB-processed thin samples, cutting gold bumps, and removing thin fi...
HiSOL,Inc.
High precision lead former Smart Flex
20+ people viewing
Last viewed: 1 day ago
■Summary Fancourt's lead former is a machine with overwhelming precision and excellent operability backed by over 45 years of e...
HiSOL,Inc.
Failure analysis device Multifunctional handling and processing system Model SS
10+ people viewing
Last viewed: 1 day ago
Precise processing such as collecting fine objects such as FIB-processed thin samples, cutting gold bumps, and removing thin fi...
Profile
| Country | Japan |
|---|---|
| Address | 1-17-6, Ueno, Taito-ku, Tokyo, Japan |
| Company Type | Manufacturer , Distributor |
| Website | HiSOL,Inc. Website |
Products
2 HiSOL,Inc.'s products are listed.