FIB-SEM Crossbeam realizes 3D analysis and sample preparation with high throughput
Carl Zeiss Co., Ltd.
About This Product
■Summary
A high-resolution field emission scanning electron microscope (FE-SEM) that combines imaging and analysis performance is integrated with next-generation focused ion beam (FIB) processing capabilities. Suitable for multi-user facilities and research and development in academic and industrial laboratories. Crossbeam speeds up FIB applications in milling, imaging and 3D analysis.
Technical specifications
■SEM: Crossbeam 350
Schottky Emitter/1.7nm@1kV/1.5nm@1kV (using Tandem Decel) /1.9nm@200V (using Tandem Decel) /0.9nm@15kV/0.7nm@30kV (STEM mode) /2.3nm@1kV (WD5mm) /1.7nm@1kV (using Tandem Decel, WD5 mm) /1.1nm@15kV (WD5mm) /2.3nm@20kV&10nA (WD5mm) /Beam current: 5pA to 100nA
■SEM: Crossbeam 550
Schottky Emitter/1.4nm@1kV/1.2nm@1kV (using Tandem Decel) /1.6nm@200V (using Tandem Decel) /0.7nm@15kV/0.6nm@30kV (STEM mode) /1.8nm@1kV (WD5mm) /1.3nm@1kV (using Tandem Decel, WD5 mm) /0.9nm@15kV (WD5mm) /2.3nm@20kV&10nA (WD5mm) /Beam current: 5pA to 100nA
■Detector: Crossbeam 350
Inlens SE, Inlens EsB, VPSE (secondary electron detector for variable pressure mode), SESI (secondary electron/secondary ion), aSTEM (transmission electron detector), aBSD (backscattered electron detector)
■Detector: Crossbeam 550
Inlens SE, Inlens EsB, ETD (Everhard-Thornley secondary electron detection), SESI (secondary electron/secondary ion), aSTEM (transmission electron detector), aBSD (backscattered electron detector), CL (cathodoluminescence detector)
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Product
FIB-SEM Crossbeam realizes 3D analysis and sample preparation with high throughput
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Handling Company
Carl Zeiss Co., Ltd.
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Categories
4 Models of FIB-SEM Crossbeam realizes 3D analysis and sample preparation with high throughput
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Advantage | Analysis options | Chamber size and ports | Charge control | FIB | Femtosecond laser optical system | Femtosecond laser pulse duration | Femtosecond laser scanning range size | Femtosecond laser spot size | Femtosecond laser type | Femtosecond laser wavelength (λ) | Gas | Resolution | Retractable ToF-SIMS Spectrometer Detection Limit | Retractable ToF-SIMS spectrometer Depth resolution | Retractable ToF-SIMS spectrometer Lateral resolution | Retractable ToF-SIMS spectrometer mass resolution | Retractable ToF-SIMS spectrometer mass-to-charge ratio | Stage |
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Crossbeam 350 |
Available upon quote | Variable pressure mode allows for a wide variety of samples and a wide range of in situ experiments | EDS, EBSD, WDS, SIMS, etc. | Standard (18 ports) | Flood gun/LCC (local charge removal device)/variable pressure | Liquid metal ion source (LMIS): Lifespan 3,000μAh/Resolution: 3nm@30kV (statistical method)/Resolution: 120nm@1kV&10pA (optional) | telecentric | <350fs | 40x40mm² | <15µm | DPSS | 515nm (green) | Uni-GIS: Pt, C, SiOx, W, H2O/Multi-GIS: Pt, C, W, Au, H2O, SiOX, XeF2 | 32k x 24k (up to 50k x 40k with optional Atlas 5 3D tomography module) | Boron in silicon <4.2ppm | <20nm AlAs/GaAs multilayer system | <35nm | m/Δm>500FWTM | 1~500Th | X/Y=100mm/Z=50mm, Z'=13mm/T=–4°~70°, R=360° |
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Crossbeam 550 |
Available upon quote | High-throughput analysis and imaging, high-resolution imaging in all conditions | EDS, EBSD, WDS, SIMS, etc. | Standard (18 ports) /Large size (22 ports) | Flood gun/LCC (local charge removal device) | Liquid metal ion source (LMIS): Lifespan 3,000μAh/Resolution: 3nm@30 kV (Statistical method)/Resolution: 120nm@1kV&10pA | telecentric | <350fs | 40x40mm² | <15µm | DPSS | 515nm (green) | Uni-GIS: Pt, C, SiOx, W, H2O/Multi-GIS: Pt, C, W, Au, H2O, SiOX, XeF2 | 32k x 24k (up to 50k x 40k with optional Atlas 5 3D tomography module) | Boron in silicon <4.2ppm | <20nm AlAs/GaAs multilayer system | <35nm | m/Δm>500FWTM | 1~500Th | X/Y=100mm/X/Y=153mm/Z=50mm,Z'=13mm/Z=50mm,Z'=20mm/T=–4°~70°,R=360°/T=–15°~ 70°,R=360° |
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Crossbeam laser |
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Correlative cryomicroscopy workflow |
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Click on the part number for more information about each product
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About Company Handling This Product
- Japan