Price (excluding tax)
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Back
Crystal development method
Density
Direction
Dopant
Front
Parallelity
Particle (MAX)
Primary flat
Radial ratio resistance change amount
Resistance value
Scratch, chips, peel, etc.
Wafer size
thickness
Polishing surface
Ratio resistance
Substrate thickness
inch
particle
Part Number
Test Wake Ha-N type 150mm SCLHandling Company
Tours Co., Ltd.Items marked with have different values depending on the model number.
Product Image | Price (excluding tax) | Back | Crystal development method | Density | Direction | Dopant | Front | Parallelity | Particle (MAX) | Primary flat | Radial ratio resistance change amount | Resistance value | Scratch, chips, peel, etc. | Wafer size | thickness |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Available upon quote | Etched | (1-100) cz | <5,000/cm² | <100> ± 2 ° | Rin (P) | Mirror polishing | Bow (Max): 60um TIR (MAX): 6um TAPER (Max): 12um Warp (Max): 60um | ≧ 0.3um, 30 | Length: 57.5 ± 2.5mm Valcourgance: (110) ± 2 ° SEMI compliant Secondary flat: SEMI compliant | 15% | 4 ~ 7ohm.cm | none | 150 ± 0.5mm | 675 ± 25um |