HiSOL,Inc.

■Leak detection up to 10-3ATM cc/sec Detects leaks up to 10-3ATM cc/sec using Fluorinert liquid. ■Reuse expensive Fluorinert w...

3 models listed

• Test Equipment

• Environmental Testers

This equipment is specialized for vapor deposition (vapor priming) of HMDS (hexamethyldisilazane), and various parameters of th...

• Machining / Machine Tools

• Vacuum Vapor Deposition Devices

■Features ・It monitors COF (coefficient of friction), pad surface temperature, polishing liquid temperature, room temperature ...

2 models listed

• Machining / Machine Tools

• Grinders

■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (pate...

• Meters & Instruments

• Counters

Our main product, precision spin coaters, are widely used around the world, and we have a track record of delivering more than ...

• Machining / Machine Tools

• Coating Process Equipment

This is a tabletop cleaning device that is ideal for research and development. It can be used as an alternative to hand washing...

• Cleaning Agents & Equipment

• Cleaning Systems

This is a tabletop silane CVD device for R&D that can perform automatic batch processing from plasma cleaning to workpiece dehy...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The PC software operation system allows for easy and highly reproducible implementation. Ideal for optical component mounting, ...

2 models listed

• Semiconductor Manufacturing

• Flip Chip Bonders

■Summary Model 7476D (7400D specification) is a tabletop manual wedge wire bonder. Equipped with a new mechanism X-Y-Z 3-axis m...

• Semiconductor Manufacturing

• Wire Bonders

PM6/LP70 is a precision polishing device that can perform lapping (rough polishing) and polishing in one machine. By using the ...

• Machining / Machine Tools

• Lapping Machinery

■ Ultrasonic lift-off/organic stripping equipment ideal for strong resist removal and burr removal Achieves high quality subst...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

2-8 A wide range of handling/mounting is possible by replacing adapters, regardless of the target object, such as 2-8 wafers, w...

2 models listed

• Semiconductor Manufacturing

• Flip Chip Bonders

PM6/LP70 is a precision polishing device that can perform lapping (rough polishing) and polishing in one machine. By using the ...

• Machining / Machine Tools

• Lapping Machinery

The V2000 Brightlight system is easy to use and efficient to inspect various types of defects on wafer surfaces. The system can...

• Testing Equipment

• Semiconductor inspection equipment

The HSP-200SC/HSP-300SC semi-automatic prober is a semi-automatic probe system compatible with next-generation semiconductor de...

• Testing Equipment

• Probers

This is a non-destructive analysis device that visualizes defects with spaces such as voids, cracks, and peeling. This is a wat...

• Observation Equipment

• Acoustic Microscopes

■Summary Model 7KE is a tabletop multi-wire bonder that can be used for both ball bonding and wedge bonding. Equipped with the ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

This is a tabletop batch oven that can be heated in a vacuum environment or inert gas atmosphere (N2, Ar etc.). Temperature con...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Easy sputtering with low current without using any inert gas This tabletop sputtering device is ideal for applying antistatic ...

• Machining / Machine Tools

• Sputtering Equipment

■Summary Model 4KE is a semi-automatic multi-wire bonder that can be used for both ball bonding and wedge bonding. The Y-axis ...

• Semiconductor Manufacturing

• Wire Bonders

This is a non-destructive analysis device that visualizes defects with spaces such as voids, cracks, and peeling. This is a wat...

• Observation Equipment

• Acoustic Microscopes

Diamaflow is a dicing additive from KETECA that has the world's top market share. Adding it to cutting water during dicing redu...

This equipment is specialized for vapor deposition (vapor priming) of HMDS (hexamethyldisilazane), and various parameters of th...

• Machining / Machine Tools

• Vacuum Vapor Deposition Devices

This is a tabletop batch oven that can be heated in a vacuum environment or inert gas atmosphere (N2, Ar etc.). Temperature con...

• Heat Sources

• Vacuum Ovens

G1000 is a system that uses the etching effect of gas plasma to clean the surface of objects to be cleaned in a low-pressure en...

• Cleaning Agents & Equipment

• Plasma Cleaners

■Summary The ultrasonic wedge wire bonder E series is a tabletop manual wedge wire bonder with a vertically driven X-Y-Z 3-axis...

• Semiconductor Manufacturing

• Wire Bonders

The HSP-100 and HSP-150 semi-automatic probe systems are standard semi-automatic probe systems that can measure small diameter ...

• Testing Equipment

• Probers

We offer custom double-sided semi-automatic probe systems that allow access to both the front and back sides of the wafer. It c...

• Testing Equipment

• Probers

■Summary Model 4546E is a semi-automatic multi-wedge wire bonder. The Y-axis and Z-axis are motor-controlled, allowing you to ...

• Semiconductor Manufacturing

• Wire Bonders