HiSOL,Inc.

■Features ・It monitors COF (coefficient of friction), pad surface temperature, polishing liquid temperature, room temperature ...

2 models listed

• Machining / Machine Tools

• Grinders

This equipment is specialized for vapor deposition (vapor priming) of HMDS (hexamethyldisilazane), and various parameters of th...

• Machining / Machine Tools

• Vacuum Vapor Deposition Devices

■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (pate...

• Meters & Instruments

• Counters

This is a tabletop cleaning device that is ideal for research and development. It can be used as an alternative to hand washing...

• Cleaning Agents & Equipment

• Cleaning Systems

This is a tabletop silane CVD device for R&D that can perform automatic batch processing from plasma cleaning to workpiece dehy...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Leak detection up to 10-3ATM cc/sec Detects leaks up to 10-3ATM cc/sec using Fluorinert liquid. ■Reuse expensive Fluorinert w...

3 models listed

• Test Equipment

• Environmental Testers

The PC software operation system allows for easy and highly reproducible implementation. Ideal for optical component mounting, ...

2 models listed

• Semiconductor Manufacturing

• Flip Chip Bonders

■ Ultrasonic lift-off/organic stripping equipment ideal for strong resist removal and burr removal Achieves high quality subst...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This is a non-destructive analysis device that visualizes defects with spaces such as voids, cracks, and peeling. This is a wat...

• Observation Equipment

• Acoustic Microscopes

PM6/LP70 is a precision polishing device that can perform lapping (rough polishing) and polishing in one machine. By using the ...

• Machining / Machine Tools

• Grinders

PM6/LP70 is a precision polishing device that can perform lapping (rough polishing) and polishing in one machine. By using the ...

• Machining / Machine Tools

• Grinders

Our main product, precision spin coaters, are widely used around the world, and we have a track record of delivering more than ...

• Machining / Machine Tools

• Coating Process Equipment

This is a tabletop batch oven that can be heated in a vacuum environment or inert gas atmosphere (N2, Ar etc.). Temperature con...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary Model 7476D (7600D specification) is a tabletop manual wedge wire bonder. Equipped with a new mechanism X-Y-Z 3-axis m...

• Semiconductor Manufacturing

• Wire Bonders

The V2000 Brightlight system is easy to use and efficient to inspect various types of defects on wafer surfaces. The system can...

• Testing Equipment

• Semiconductor inspection equipment

The HSP-200SC/HSP-300SC semi-automatic prober is a semi-automatic probe system compatible with next-generation semiconductor de...

• Testing Equipment

• Probers

2-8 A wide range of handling/mounting is possible by replacing adapters, regardless of the target object, such as 2-8 wafers, w...

2 models listed

• Semiconductor Manufacturing

• Flip Chip Bonders

This is a tabletop batch oven that can be heated in a vacuum environment or inert gas atmosphere (N2, Ar etc.). Temperature con...

• Heat Sources

• Vacuum Ovens

Diamaflow is a dicing additive from KETECA that has the world's top market share. Adding it to cutting water during dicing redu...

■Summary Model 4KE is a semi-automatic multi-wire bonder that can be used for both ball bonding and wedge bonding. The Y-axis ...

• Semiconductor Manufacturing

• Wire Bonders

This is a non-destructive analysis device that visualizes defects with spaces such as voids, cracks, and peeling. This is a wat...

• Observation Equipment

• Acoustic Microscopes

This equipment is specialized for vapor deposition (vapor priming) of HMDS (hexamethyldisilazane), and various parameters of th...

• Machining / Machine Tools

• Vacuum Vapor Deposition Devices

■Summary Model 7KE is a tabletop multi-wire bonder that can be used for both ball bonding and wedge bonding. Equipped with the ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

G1000 is a system that uses the etching effect of gas plasma to clean the surface of objects to be cleaned in a low-pressure en...

• Cleaning Agents & Equipment

• Plasma Cleaners

■Summary Model 4546E is a semi-automatic multi-wedge wire bonder. The Y-axis and Z-axis are motor-controlled, allowing you to ...

• Semiconductor Manufacturing

• Wire Bonders

■Easy sputtering with low current without using any inert gas This tabletop sputtering device is ideal for applying antistatic ...

• Machining / Machine Tools

• Sputtering Equipment

The HSP-100 and HSP-150 semi-automatic probe systems are standard semi-automatic probe systems that can measure small diameter ...

• Testing Equipment

• Probers

■Summary The ultrasonic wedge wire bonder E series is a tabletop manual wedge wire bonder with a vertically driven X-Y-Z 3-axis...

• Semiconductor Manufacturing

• Wire Bonders

Logitech (UK), which has a history of over 50 years in the polishing industry, provides the highest level polishing equipment a...

• Semiconductor Manufacturing

• Chemical Mechanical Polishing (CMP) Machines