Adwells Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

2 registered Semiconductor Manufacturing Equipment Component & Part Machining of Adwells Co., Ltd.

Adwells Co., Ltd.

Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)

Ultrasonic joiner ideal for power devices ・ High rigidity horn clamp mechanism ・ High -precision position control ・ Enriched process monitoring...


1 model listed

Adwells Co., Ltd.

Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)

High accuracy implementation with ultrasonic processes ・ High accuracy implementation with ultrasonic process ・ High -precision positioning func...


1 model listed


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