Stamped mold that minimizes inner lead deformation
ROHM MECHATECH
About This Product
■ Realize the package mirror finish of 0.5 μRz
The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.
■ Rohm Mecatech's technology used in state -of -the -art digital devices
Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.
■ Characteristics
It is a seutal mold used for lead frame production, minimizing inner lead deformation by taking advantage of excellent processing and assembly accuracy. The aperture mold used for the laser diode cap is also added to the new lineup.
-
Product
Stamped mold that minimizes inner lead deformation
-
Handling Company
ROHM MECHATECH
1 Models of Stamped mold that minimizes inner lead deformation
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
Stamping mold |
Available upon quote |
Other products of ROHM MECHATECH
View more products of ROHM MECHATECH
