Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)
Adwells Co., Ltd.
About This Product
Ultrasonic joiner ideal for power devices
・ High rigidity horn clamp mechanism
・ High -precision position control
・ Enriched process monitoring function
■ Same species / hydrophiled metal joining
Difficult metal joining is possible with normal welding. The materials are directly joined at room temperature without using soldering.
■ IGBT module (terminal joining)
In the IGBT module where the operating temperature rises, it is desirable to do not use soldering. By ultrasound, the package side lead and the DBC substrate electrode are directly joined.
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Product
Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)
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Handling Company
Adwells Co., Ltd.
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Categories
1 Models of Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)
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Ultrasonic metal joining device for power devices |
Available upon quote |
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About Company Handling This Product
- Japan