Hugle Electronics Co., Ltd.

This device is a wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafers. The automatic carrie...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

This is a fully automatic cleaning device (patented) for EUVPOD used in EUV exposure, the latest exposure technology. In additi...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

As an automatic cleaning device for FOUPs for 300mm wafers, this is a model change of the UPC-12100, which has earned the world...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This device was developed as a successor to the CRD-4500, and is an automatic cleaning system that can handle up to 8" wafer ca...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

Next generation high precision bond tester. Easy data management is achieved using the Windows-based software "Bond Test Manage...

• Testing Equipment

• Semiconductor Inspection Equipment

Pneumatic inker is a pneumatic marking system. Unlike the inkjet type, this is a marking method that transfers the ink beads*1 ...

• Drive Mechanisms & Components

• Actuators

Our unique method allows chips to be peeled off from the dicing tape without damaging the back side. ■Product overview ・Model...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The inker base is a manipulator exclusively for die mark holders that does not have an X-Y-Z axis adjustment mechanism and is u...

• Drive Mechanisms & Components

• Actuators

A manual pneumatic inker used for appearance and visual inspection of semiconductor wafers, electronic devices, etc. Marking is...

• Drive Mechanisms & Components

• Actuators

The Daimark holder is a special jig for using filament type DM1 cartridges. It consists of a holder part (cartridge fixing part...

• Fixtures

• Jig Parts

The HS-1840 wafer expansion device was developed from the customer's perspective, based on years of accumulated know-how and nu...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

This is a front-operated manual set type developed for precision cleaning and drying of 8-inch SMIFPODs. The IA-8 is a cleaning...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This is a UV irradiation device that uses a black light as a light source and was developed for curing UV curable tape for semi...

• Light Sources

• UV Curing Systems

This is a UV irradiation device using an LED as a light source, which was developed for curing UV curable tape for semiconducto...

• Light Sources

• UV Curing Systems

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it ...

• Machining / Machine Tools

• Packaging Machinery

A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-savi...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

Choosing the right dicing tape for the purpose is an important issue. We offer general UV tape, non-silicon PVC tape, and a wid...

This is a high-performance, low-cost, and small-sized wire pull test device that can perform destructive and non-destructive te...

• Testing Equipment

• Semiconductor Inspection Equipment

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it ...

• Machining / Machine Tools

• Packaging Machinery

The lineup of cartridge-type ink die marks includes 3 types of heat-curing type and 3 types of natural-curing type, allowing yo...