Hugle Electronics Co., Ltd.

A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-savi...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

Choosing the right dicing tape for the purpose is an important issue. We offer general UV tape, non-silicon PVC tape, and a wid...

USW-102 is a non-contact web cleaner that uses unique ultrasonic cells arranged in two rows to powerfully remove foreign substa...

2 models listed

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

A manual pneumatic inker used for appearance and visual inspection of semiconductor wafers, electronic devices, etc. Marking is...

• Drive Mechanisms & Components

• Actuators

A space-saving and energy-saving ultrasonic board cleaner. The cleaning head is slim due to its compact design, and the blower ...

2 models listed

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

This cleaning device is ideal for customers who are considering switching from conventional contact cleaning methods such as br...

The inker base is a manipulator exclusively for die mark holders that does not have an X-Y-Z axis adjustment mechanism and is u...

• Drive Mechanisms & Components

• Actuators

A non-contact dry cleaner that can be used for cleaning mounter tables (stages), before pasting dicing tape, BG tape, and prote...

This is a UV irradiation device using an LED as a light source, which was developed for curing UV curable tape for semiconducto...

• Light Sources

• UV Curing Systems

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it ...

• Machining / Machine Tools

• Packaging Machinery

Space-saving and energy-saving ultrasonic board cleaner (for both sides). By operating with optimal air balance, it is possible...

2 models listed

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it ...

• Machining / Machine Tools

• Packaging Machinery

This is a high-performance, low-cost, and small-sized wire pull test device that can perform destructive and non-destructive te...

• Testing Equipment

• Semiconductor Inspection Equipment

The lineup of cartridge-type ink die marks includes 3 types of heat-curing type and 3 types of natural-curing type, allowing yo...