Hugle Electronics Co., Ltd.'s Company Profile and Products

The ultra-thin and compact design saves space and is designed to be installed in tight spaces such as inside equipment. This is...

• Electromagnetic Countermeasures

• Air Ionizers

Equipped with the new function Pulse Air, it is now possible to further improve the dust removal rate. This pen-type ionizer sp...

• Electromagnetic Countermeasures

• Air Ionizers

This product has been renewed as "MODEL 307R" by adding a safety circuit function to the conventional specifications. Equipped ...

• Electromagnetic Countermeasures

• Air Ionizers

This product has a built-in lithium-ion battery and control board, eliminating the need for a controller and high-voltage cable...

• Electromagnetic Countermeasures

• Air Ionizers

A new control method (flexible AC) generates ions and by switching the frequency, it optimally eliminates static electricity ov...

• Electromagnetic Countermeasures

• Air Ionizers

This is a DC type ionizer bar that can be manufactured in millimeter units according to customer requests. Installation in manu...

• Electromagnetic Countermeasures

• Air Ionizers

MODEL 7100 is the latest multi-plate monitor MP1 that can be used for performance measurement and maintenance of ionizers. It i...

• Meters & Instruments

• Charge late Analyzers

Various ionizers (static eliminators) are essential for static electricity countermeasures in LCD panel and semiconductor manuf...

• Measuring Equipment

• Electrostatic Instruments

Corona discharge type ionizers require regular maintenance. Foreign matter, such as suspended matter or gas particles, adheres ...

A space-saving and energy-saving ultrasonic board cleaner. The cleaning head is slim due to its compact design, and the blower ...

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

Space-saving and energy-saving ultrasonic board cleaner (for both sides). By operating with optimal air balance, it is possible...

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

A small cleaner that can handle an effective length of up to 400mm. Ideal for removing dust from small display boards and flat ...

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

USW-102 is a non-contact web cleaner that uses unique ultrasonic cells arranged in two rows to powerfully remove foreign substa...

• Pumps

• Powder Pumps

A space-saving and energy-saving ultrasonic web cleaner. The cleaning head is slim due to its compact design, and the blower un...

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

This cleaner is ideal for cleaning the surface of films up to 300mm wide. ■Product overview ・Cleaning of film width approxima...

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

This cleaner is ideal for removing cutting powder from the work edge immediately after slitting. When used in conjunction with ...

A non-contact ultrasonic cleaner ideal for extremely small points. By using it in conjunction with an ejector unit, it is also ...

• Cleaning Agents & Equipment

• Ultrasonic Cleaning Machines

This cleaning device is ideal for customers who are considering switching from conventional contact cleaning methods such as br...

A non-contact dry cleaner that can be used for cleaning mounter tables (stages), before pasting dicing tape, BG tape, and prote...

Is it possible to make the invisible earth visible? Using the explosion-proof earth checker EC10, you can easily and reliably c...

We live in an era where the concept of maintaining and improving high productivity in semiconductor manufacturing by cleaning F...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

As an automatic cleaning device for FOUPs for 300mm wafers, this is a model change of the UPC-12100, which has earned the world...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This is a front touch panel type manual cleaning machine developed for precision cleaning and drying of 8-inch SMIFPOD. The IA-...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This device was developed as a successor to the CRD-4500, and is an automatic cleaning system that can handle up to 8" wafer ca...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This is a fully automatic cleaning system for RSP200 and RSP150, which are specialized containers for reticles. This device is ...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

This is a fully automatic cleaning device (patented) for EUVPOD used in EUV exposure, the latest exposure technology. In additi...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

The lineup of cartridge-type ink die marks includes 3 types of heat-curing type and 3 types of natural-curing type, allowing yo...

The Daimark holder is a special jig for using filament type DM1 cartridges. It consists of a holder part (cartridge fixing part...

• Fixtures

• Jig Parts

The inker base is a manipulator exclusively for die mark holders that does not have an X-Y-Z axis adjustment mechanism and is u...

• Drive Mechanisms & Components

• Actuators

A manual pneumatic inker used for appearance and visual inspection of semiconductor wafers, electronic devices, etc. Marking is...

• Drive Mechanisms & Components

• Actuators

Pneumatic inker is a pneumatic marking system. Unlike the inkjet type, this is a marking method that transfers the ink beads*1 ...

• Drive Mechanisms & Components

• Actuators

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it ...

• Machining / Machine Tools

• Packaging Machinery

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it ...

• Machining / Machine Tools

• Packaging Machinery

This is a device that tape mounts wafers. Can be applied evenly without bubbles. (Supports up to 6 inch wafers) It is also poss...

• FA Equipment

• Mounters

Mount the dicing frame and wafer on tape and cut. Can be applied evenly without bubbles. (Supports up to 8 inch wafers) It is a...

• FA Equipment

• Mounters

Choosing the right dicing tape for the purpose is an important issue. We offer general UV tape, non-silicon PVC tape, and a wid...

This is a wafer expansion device equipped with a grip ring auto-clamp mechanism. The cutter mechanism built into the stage make...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The HS-1840 wafer expansion device was developed from the customer's perspective, based on years of accumulated know-how and nu...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-savi...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

This is a UV irradiation device that uses a black light as a light source and was developed for curing UV curable tape for semi...

• Light Sources

• UV Curing Systems

This is a UV irradiation device using an LED as a light source, which was developed for curing UV curable tape for semiconducto...

• Light Sources

• UV Curing Systems

Our unique method allows chips to be peeled off from the dicing tape without damaging the back side. ■Product overview ・Model...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum w...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum w...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one s...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y slidin...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

Next generation high precision bond tester. Easy data management is achieved using the Windows-based software "Bond Test Manage...

• Testing Equipment

• Semiconductor Inspection Equipment

This is a high-performance, low-cost, and small-sized wire pull test device that can perform destructive and non-destructive te...

• Testing Equipment

• Semiconductor Inspection Equipment

This device is a wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafers. The automatic carrie...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining