Price (excluding tax)
■ Overview / features ・ Stratix 10 FPGA board equipped with 16GB HBM2 ・ Powerful solution that speeds up memory bound applications The 520N-MX designed to speed up is a PCIE board equipped with Intel's integrated Intel Stratix 10 MX2100 FPGA. The size and speed of the HBM2 (up to 512GB/s for 16GB) enables speeding up memory bound applications. The 100g QSFP28 on the board is ideal for clustering, and the Oculink connector enables extension. The conventional HDL and higher abstract C, C ++, and OpenCl -based toolflows are supported. The product contains an optimized board support package (BSP) for Intel OpenCl SDK. ■ QSFP cage ・ 4 QSFP28 cages of the front panel connected directly to FPGA via 16 transceivers ・ 10/25/40/100 GBE User programable low jitter crocking ・ Each QSFP28 can clock independently ・ Jitter cleaner for network recovery clocking ・ 100GBE Mac Hard IP available for 2 QSFP28
You can search for other models from each index. The displayed value is the value of the currently selected part number.
Board Management Controller
External memory
Foam factor
Fpga
Host interface
Oculink
On -board flash
cooling
environment
power supply
quality
Part Number
520N-MXHandling Company
Fuji Soft Co., Ltd.Items marked with have different values depending on the model number.
Product Image | Price (excluding tax) | Board Management Controller | External memory | Foam factor | Fpga | Host interface | Oculink | On -board flash | cooling | environment | power supply | quality |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Available upon quote | can be | Two 288 -pin DIMM slot (total 32GB) equipped with a 16GB module by default | Standard-Height PCIE dual slot board, 4.376 x 10.5 inches (111 x 266.7mm) | INTEL STRATIX 10 MX (MX2100 of F2597 package), 16GBYTES On -chip high bandwidth memory (HBM2) DRAM, 410GB/s (Speed Grade 2) | X16 GEN3 interface directly connected to FPGA | 2X edge comector (a, b) @12.5g per lane (default): PCIe Gen 3 X8 Hard IP, GPIO, PCIe Master, Optional input clock, etc. | 2GBit flash memory to launch FPGA | Standard: DOUBLE-WIDTH Active Heat Sink (with fan), Options: DOUBLE-WIDTH Passive Heat Sink, Options: DOUBLE-WIDTH liquid cooling | Operation temperature: 5 to 35 ℃ | Onboard power supply obtained from 12V PCIe slots and two AUX connectors (1 8 pins, 6 pins per pin) | ISO9001: 2015 manufactured by IPC-A-610-Class III, Rohs compatible, CE/FCC/ICES approval |