Price (excluding tax)
■ Characteristics ・ Vaporiture ・ After applying a thin film metal membrane in a spatta, it is possible to use a wet process to 1 to 10 μm for copper and gold. ・ VIA fills and side metrasies can also be supported ・ Chip size 0.3mm × 0.6mm × 0.1t substrate can be supported
You can search for other models from each index. The displayed value is the value of the currently selected part number.
See all 2 models in listPart Number
Thin film ceramic substrateProduct
Ceramic substrateHandling Company
Noshimitsu Photo Service Co., Ltd.Items marked with have different values depending on the model number.
Product Image | Price (excluding tax) |
---|---|
Available upon quote |
Noshimitsu Photo Service Co., Ltd.