Crystal wafer | Artificial crystal (for crystal mobility/optical/SAW device)
NIHON DEMPA KOGYO CO., LTD.
Price (excluding tax)
Model Description
Feature ◼︎AT Cut Wayha We manufacture round plates and square plates. Please specify the cutting angle (direction (θ)) and the presence of seed crystals. Dimensions, thickness, and main finishes will be manufactured according to your request. ◼︎SAW device wafer Please specify the cutting angle (direction (θ)). The thickness will be manufactured according to your request. ◼︎The tuning fork type crystal vibration wafer The wafer is compatible with 3 inches and 4 -inch sizes. ◼︎Conbulating substrate crystal wafer Up to 6 inches. The surface roughness on the main aspect is 0.5 nm or less, and the TTV (TTV (Total Thickness Variation)) is finished 0.5 µm or less. Please try it for the past board.
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Part Number
Crystal wafer
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Handling Company
NIHON DEMPA KOGYO CO., LTD.
Artificial crystal (for crystal mobility/optical/SAW device) Crystal wafer's performance table
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There are 6 models for this product.
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About Company Handling This Product
- Japan
- Since 1948
- 2,378 employees