Yamaha Robotics Holdings Co., Ltd.

■Summary This is a part in which thermosetting resin is placed inside the pot of the mold, and the thermosetting resin is injec...

• Fixtures

• Plungers

■Summary ・High-speed wire bonder that is the culmination of the series ・Upgraded version of basic model for gold wire bonding...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed, high-precision die bonder for small chips ・Compatible with eutectic, WBC/DAF, and epoxy processes ・Thi...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Package bonder compatible with Chip to Wafer's Thermal Compression Bonding (TCB) method ・Compatible with face down ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of multi-wire compatible model th...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary The CAM system utilizes the know-how cultivated over many years to help improve productivity, implementation quality, ...

• Development & Design

• CAD/CAM Systems

■Summary High-speed wire bonder compatible with wide frames and suitable for LED and discrete production. ■Features - Renewed ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary High precision twin head die bonder. A highly productive, space-saving, high-precision die bonder equipped with dual b...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Features ・By using wire bonder UTC-5000 as a base, high-speed bonding of 30ms/bump is achieved. ・Equipped with a wafer rotat...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of wide frame compatible model co...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・This is a device that detects gross leaks in SMD crystal resonators. ・With a patented inspection method, stable gro...

• Testing Equipment

• Air Leak Testers

■Summary ・Achieved approximately 3 times the productivity and approximately 2 times the high precision mounting compared to co...

• Semiconductor Manufacturing

• Flip Chip Bonders

■Summary ・A wafer prober that measures the frequency of a tuning fork type crystal resonator or AT type crystal resonator form...

• Measuring Equipment

• Frequency Meters

■Summary ・Transfer molding equipment that can efficiently mass produce power semiconductors and large electronic devices ・Equ...

• Machining / Machine Tools

• Molding Machinery

■Summary ・Package bonder compatible with Chip to Substrate's Thermal Compression Bonding (TCB) method ・Compatible with face d...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Inherited the module concept of Apic Yamada's previous COMBO series ・Support for upsizing and matrix formation for ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Manual system using the same molding machine as automatic machine ・Semiconductor packages, general electronic compo...

• Machining / Machine Tools

• Molding Machinery

■Summary ・Manual system for simple prototyping and mass production ・The press module uses AC servo motors for clamp and trans...

• Machining / Machine Tools

• Molding Machinery

■Summary ・This is a device that adjusts the oscillation frequency by laser trimming the metal thin film of a tuning fork cryst...

• Machining / Machine Tools

• Laser Machinery

■Summary This device is a fully automatic device that applies UV curing adhesive to the VCM unit of the camera module, inserts ...

• FA Equipment

• Inserters

■Summary ・This device performs room temperature inspection, printing inspection, and taping of SMD crystal resonators at high ...

■Summary In addition to transfer molding, there is also "compression molding" in resin molding. In addition to molding the wafe...

■Summary Continuous furnace equipment that receives the frame after resin sealing and puts it into the furnace together with th...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Ensuring advanced molding technology and stable quality ・Available from small quantity to mass production ・Support...

• Machining / Machine Tools

• Molding Machinery

■Summary ・Standard transfer mold system that inherits the previous model - Adopts new interface and control equipment. Ease of...

• Machining / Machine Tools

• Molding Machinery

■Summary This is a device that inspects the temperature characteristics of SMD type crystal oscillators. DIP (dip) testing of t...

■Summary In the semiconductor assembly process, "resin molding" refers to a product in which a semiconductor chip is mounted on...

■Summary This device is a fully automatic device that adjusts the optical axis of a smartphone's dual camera and fixes it to a ...

■Summary -This is the industry's highest level equipment that applies adhesive to the SMD type crystal device package and mount...

• FA Equipment

• Mounters

■Summary ・This is a fully automatic device that applies a line of Ag paste between the stiffener (reinforcing material) bonded...

• Machining / Machine Tools

• Coating Process Equipment