OKI Circuit Technology Co.,Ltd.

FITT (Fine Pitch Through Via Technology) Achieves 0.35mm pitch and 1,000 -pin BGA compatible 32 -layer printed wiring board by ...

• Boards & Circuit Boards

• Printed Circuit Boards (PCB)

･ We provide high -precision and high -rise substrates corresponding to the microscopic and multi -pin of semiconductors. ･ We...

• Boards & Circuit Boards

• Glass Epoxy Substrates

･ We provide high -precision and high -rise substrates corresponding to the microscopic and multi -pin of semiconductors. ･ Tr...

• Testing Equipment

• Probe Cards

It provides a print wiring board that enhances heat dissipation by installing a metal core metal base.

• Clamps & Fasteners

• Base Plates

We provide one -stop impedance and delay time control of the entire transmission route on high -speed substrates. Feature ･ Si...

2-8 layers of flexible layers (ZO control is also possible). Connection defects, connector contact resistance, implementation ...

• Boards & Circuit Boards

• Rigid-Flex Printed Circuit Boards (PCB)

･ We provide a high -integrated large multi -layered substrate that supports multi -pin (1,000 pin class). ･ We provide high -...

• Boards & Circuit Boards

• Rigid PCBs

Hyaku copper etching technology, thick copper piled technology Feature ･ Conventional products have a copper thickness of abou...

Realizes 100 layers on a rigid substrate using high TGFR-4 Compatible with high -density wiring accommodation while ensuring el...

• Boards & Circuit Boards

• Rigid PCBs

A different plate thickness was realized with one printed wiring board. The terminal part can coexist with a plate thickness o...

• Boards & Circuit Boards

• Rigid PCBs

Realizes 32Gbps / Lane high -speed transmission by electrical transmission by pursuing design, material and manufacturing proce...

We provide the best VIA structure to the GHz compatible print wiring board. Action ･ The difference between the characteristic...