OHMIYA IND.CO.,LTD

Myself-1 FAB is a system that can be installed on various grinding machines and rotating bodies to measure vibration in a short...

• Meters & Instruments

• Field Balancers

Myself-1 typeTII is a field balancer that anyone can easily perform high-precision balancing (balance correction/balance adjust...

• Meters & Instruments

• Field Balancers

A fully automatic expander is a device that stretches the dicing tape after dicing. It automatically separates and expands the ...

• Fastening Components

• Expander

The carrier cleaning machine is a cleaning and drying device for wafer carriers and carrier boxes. Cleaning with a high-pressur...

• Semiconductor Manufacturing

• Semiconductor Cleaning Equipment

MyTENTA-1/PB (MyTENTA-1/PB) uses AE sensor technology to instantaneously perform workpiece touch and dress touch in ultra-fine ...

• Sensors

• Tactile Sensors

There are devices that test the degree of bonding of grinding wheels by manually turning the handle, but with manual testing, t...

The wafer expander is a tabletop type expanding device that allows you to expand, fit grip rings, and cut tape with one touch. ...

The manual wafer mounter is a manual wafer mounter that affixes various tapes such as dicing tape, back grind (BG), protective ...

• FA Equipment

• Mounters

This device uses a halogen heater and hot air to solder small surface mount components such as BGA and CSP. This allows for mou...

• FA Equipment

• Mounters

The black light specification manual UV irradiation machine is a tabletop type UV irradiation device that cures UV-curable tape...

• Light Sources

• UV Curing Systems

Our rotating spin dryer is a stand-alone type wafer centrifugal drying device with a diverse lineup. A variety of options are a...

A fully automatic tape remover is a device that removes the protective film pasted on wafers. Wafers supplied in a cassette are...

Dynarector is a device that performs balance correction processing by measuring the balance of assembled workpieces and then tr...

• Test Equipment

• Balancing Machinery

The fully automatic UV irradiation machine with black light is a device that automatically takes out the wafer frame supplied b...

• Light Sources

• UV Curing Systems

The fully automatic BG tape laminator is an automatic device that can cut the outer periphery after applying backgrinding tape ...

This is a device that can measure static balance (static unbalance) with high precision without rotating the workpiece. The mea...

• Test Equipment

• Balancing Machinery

A semi-automatic tape mounter is a device that affixes pre-cut tapes (dicing tape, protective tape, die attach film (DAF), etc....

• FA Equipment

• Mounters

A wafer transfer machine is an automatic machine that transfers wafers from carrier to carrier or from carrier to boat in both ...

Environmental air intake system eliminates the need for N₂. Reduces running costs and improves static elimination effect *N₂ re...

In recent years, devices such as bumps, MEMS, TAIKO®*1, and backside mounting have increasingly had large steps formed on the f...

This is a semi-automatic tape mounter that can attach wafers in a vacuum chamber. Our unique pre-cut unit is also included as s...

• FA Equipment

• Mounters

The transfer device is a device that uses a unique transfer technology to transfer the wafer mounted on a dicing frame to anoth...

High-pressure mercury/metal halide fully automatic UV irradiation equipment is an ultraviolet curing equipment that uses a lamp...

• Light Sources

• UV Curing Systems

ACF crimping equipment is an anisotropic conductive film used to connect FPCs/boards used in automotive, industrial, and consum...

A fully automatic wafer mounter is a fully automatic type of device that mounts wafers on a dicing frame (tape frame) before di...

• FA Equipment

• Mounters

The manual tape remover is a manual tape removal machine that manually removes protective tape such as BG (back grind) tape att...

BGA (CSP) cutting equipment is a device that reduces heat load and removes surface-mounted ICs such as BGA and CSP by cutting. ...

• Machining / Machine Tools

• Cutting Machines

Face-down expansion and forced suction from the bottom of the stage limit the adhesion of Si particles generated during cutting...

This is a device that peels off the protective tape attached to dicing rings and wafers. The industry's first ultrasonic weldin...

The semi-automatic tape remover is a semi-automatic tape removing machine that removes protective tape such as BG (back grind) ...