Relatec Co., Ltd.

A die collet is a consumable part used in the die bonding process of semiconductor manufacturing to pick up chips with push-up ...

• Fixtures

• Collets

The resin collet is a collet with different characteristics from other metal collets, which was developed to suppress the impac...

• Fixtures

• Collets

The window clamper is a fixture that secures the fingers of the lead frame to the heat block to enable wire bonding between the...

• Fixtures

• Jig Parts

Transfer pins are parts used in semiconductor manufacturing to spread solder uniformly on the stage and transfer the solder to ...

• Fixtures

• Jig Parts

Capillaries are components used to connect IC chip electrodes and lead terminals with wires during the wire bonding process in ...

• Hoses / Tubes

• Capillaries

The correction claw is a part used to correct tilted chips during the die bonding process during semiconductor manufacturing.

• Fixtures

• Jig Parts

A suction nozzle is a component used to suction and pick up IC chips, etc., and transport and bond them onto a lead frame, or i...

• Fixtures

• Jig Parts

A stage is a component (table) used to hold a wafer during the process of making chips from a wafer in the semiconductor manufa...

• Fixtures

• Jig Parts

A heat top is a jig that suctions and fixes a lead frame from the bottom during the wire bonding process of semiconductor manuf...

• Fixtures

• Jig Parts

An intermediate pocket is a part used as a relay when transporting an object from one process to another when sucking and disch...

• Fixtures

• Jig Parts

A leaf spring is a metal plate made from a material with a certain amount of springiness and shaped to suit the purpose. They a...

• Springs

• Flat Springs