CUI Japan's Heat Sinks
30 registered Heat Sinks of CUI Japan
CUI Japan
Cooling parts heat sink / BGA heat sink
The Cui Devices BGA heat sink, which is compatible with the Ball Grid Array (BGA) device, is made of a black aluminum finish aluminum and features ...
CUI Japan
Cooling parts board level heat sink / extruded heat sink
Cui Devices, a series of extruded aluminum heat sinks, offers a complex fin structure and large surface area that improves heat dissipation in high...
CUI Japan
Cooling parts board level / heat sink / punching heat sink
CUI Devices, ideal for cooling low -power PCB, is a black aluminum or copper made of tin -plated or copper. Our stamping, which supports various t...
Check the product list of CUI Japan
