Board to Board Connector FS Series SMD Male Connector
PHOENIX CONTACT
About This Product
■High-speed data transmission with 0.635mm pitch
The FS 0,635 series space-saving board-to-board connectors enable mezzanine-oriented printed circuit board placement for high data transmission rates up to 40Gbps. The floating system has a tolerance compensation of up to 0.7mm in the x and y directions and 0.6mm in the z direction.
■Features
・Design-in support during device development using M-CAD/E-CAD data and free sample service
-Cost and space savings with a wide range of products available in various stacking heights
・Easy mating with built-in keyway and tolerance compensation for error-free connection
・Tolerance and mechanical stress compensation for secure connection with floating function
・Reduced customer-specific simulation time for data alignment during the development process
・High-speed data transmission of up to 30Gbps that enables various applications
*Other model numbers are available.
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Product
Board to Board Connector FS Series SMD Male Connector
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Handling Company
PHOENIX CONTACT
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Categories
10 Models of Board to Board Connector FS Series SMD Male Connector
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Classification temperature Tc | Color (housing) | Contact cover | Contact material | Contact resistance | Height (h) | Height above board | Insulation material | Length (l) | Material data - Contact information Notes | Metal surface treatment Soldering part (base) | Metal surface treatment Soldering part (finishing) | Metal surface treatment contact part (base) | Metal surface treatment contact part (finish) | Moisture Sensitivity Level (MSL) | Mounting type | Notes during operation | Number of poles | Number of reflow soldering | Number of rows | Pin arrangement | Pitch | Pollution level | Process | Rated surge voltage (I/1) | Rated voltage (I/1) | Standard IN | Surface properties | Width (w) | Withstand voltage |
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FS 0,635/ 20-MV-R- 5,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 40mΩ | 5.6mm | 5mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 20 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 13.22mm | 500V AC IEC 60512-4-1:2003 |
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FS 0,635/ 40-MV-R- 5,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 40mΩ | 5.6mm | 5mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 40 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 19.57mm | 500V AC IEC 60512-4-1:2004 |
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FS 0,635/ 60-MV-R- 5,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 40mΩ | 5.6mm | 5mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 60 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 25.92mm | 500V AC IEC 60512-4-1:2005 |
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FS 0,635/ 80-MV-R- 5,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 40mΩ | 5.6mm | 5mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 80 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 32.27mm | 500V AC IEC 60512-4-1:2006 |
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FS 0,635/ 20-MV-R- 8,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 70mΩ | 8.6mm | 8mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 20 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 13.22mm | 500V AC IEC 60512-4-1:2007 |
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FS 0,635/ 40-MV-R- 8,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 70mΩ | 8.6mm | 8mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 40 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 19.57mm | 500V AC IEC 60512-4-1:2008 |
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FS 0,635/ 60-MV-R- 8,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 70mΩ | 8.6mm | 8mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 60 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 25.92mm | 500V AC IEC 60512-4-1:2009 |
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FS 0,635/ 80-MV-R- 8,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 70mΩ | 8.6mm | 8mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 80 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 32.27mm | 500V AC IEC 60512-4-1:2010 |
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FS 0,635/ 20-MV-R- 9,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 70mΩ | 9.6mm | 9mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 20 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 13.22mm | 500V AC IEC 60512-4-1:2011 |
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FS 0,635/ 40-MV-R- 9,0 |
Available upon quote | 260°C | Black (9005) | 0.6mm | Copper alloy | 70mΩ | 9.6mm | 9mm | LCP | 5.2mm | WEEE/RoHS compliant, whisker free, IEC 60068-2-82/JEDEC JESD 201 compliant | Nickel (Ni) | Suzu (Sn) | Nickel (Ni) | Gold (Au) | MSL 1 | SMD solder connection | The permissible voltage during operation depends on the application, taking into account clearance and creepage distances within the insulation requirements according to IEC 60664-1. | 40 | 3 | 2 | Linear pad shape | 0.635mm | 3 | Reflow soldering | 0.8kV | 125V | 0.5A IEC 60512-5-2:2002-02 (40 poles/60 poles) | Selective coating | 19.57mm | 500V AC IEC 60512-4-1:2012 |
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